Skip Navigation LinksHome : Book details 		 

 Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (IEEE Press) free ebook download



Category:
Other Engineering

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (IEEE Press)
Views:  199
Likes:  45

Catalogue

Author(s): Steffen Krohnert
Date: 2021 Format: pdf Language: English ISBN/ASIN: 1119793777  
Pages: 320 OCR: Quality: ISBN13:  
Uploader: maveriks Upload Date: 1/2/2022 4:37:06 AM      
To download click on link in the Links Table below                                                                       

Description: Click to see full description


Links Table  
 TitleLinkPasswordSize (MB)Thank toInform Admin
3068799Bookhttps://nitro.download/view/F4298F8EBB8F... 0.00maveriks

Tags: Advanced Application Compute Embedded Fan-Out High IEEE Level Packaging Panel

Title Link Password Size Reason
 
Those who downloaded this book also downloaded the following books:

Comments
New comment:              

  
(C) FreeBookSpot 2007 - 2024