Home : Book details : Book description

Description of  Scaling And Integration Of High-speed Electronics And Optomechanical Systems (Selected Topics In Electronics And Systems Book 59)

B06ZZ4GS8V pdf Coined as the third revolution in electronics is under way Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations) the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.