Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) free ebook download.

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) free ebook download

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Author(s):	Juan Cepeda-Rizo

Date:	2021	Format:	pdf	Language:	English	ISBN/ASIN:	1032160810
Pages:	342	OCR:		Quality:		ISBN13:
Uploader:	gestalt	Upload Date:	11/23/2021 8:09:05 AM

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Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example.
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	Title	Link	Password	Size (MB)	Thank to	Inform Admin
3053238	Book	https://k2s.cc/file/4c4e198f9ff38/103216...		0.00	gestalt

Tags: Aerospace Analysis Civil Electronic Engineering Environments Extreme Manufacturing Mechanical Packaging

Title	Link	Password	Size	Reason

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